ACCESS will continue to offer leading substrate technology solutions and maintain its technology advantages by continuous R&D investments and innovations. With “Minimization” and “Integration” being the trends of semiconductor industry including substrates products, ACCESS will focus its research and technology innovation on those two areas in the next few years. ACCESS’s Embedded Passive Component can integrate components into substrates with size down to 40um or below and dielectric thickness down to 25um or below, offering smaller and more compact Packaging solutions.

ACCESS has obtained or applied patents in US, China, Japan, Korea, Taiwan, Israel, and European countries, and will continue to apply patents globally to protect our technology innovations, production processes, and product designs. Our patent strategy is not only to protect us from competitors copying our production processes, but also protect us from competitors manufacturing products with similar designs.