Sputtering

ACCESS use well understood processing technologies from semiconductor wafer industries---sputtering for seed layer sowing. It can create a very thin and uniform ( 1um or below with +/-0.15um tolerance).  This enable quick/flash etch in seed layer etch process to reduce the side-etch/undercut, this will help in fine-line technology.

 Based on this, ACCESS enables to produce 15um conductor line with 15 um space.  And further technology study will go to 10/10um or below.